Features:

• Semiconductor refrigeration + large area heat sink. For the hot spots of mobile phones, a large-area soaking plate is used to quickly neutralize the heat to achieve uniform heat dissipation.
• Easy to take and stick, comes with silicone protection, soft, does not hurt the phone, does not scratch the hand
• Strong paste. No shedding of strong adhesive, firm adsorption, not afraid of the radiator falling
• Give you a thin and light experience, the thickness is only 1mm, closely fit the mobile phone, thin and light experience
• Magnetic suction type/back clip semiconductor type heat sink is suitable. Closely fit the mobile phone, seamless conduction of cold in all directions

Specification:

• Product color: Black
• Product material: Aluminum sheet + silicone
• Scope of application: Mobile phone semiconductor radiator
• Product size: 60x106x1mm/2.36×4.17×0.04in
• Product weight: 18g